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Submicrocristalline Structure in Copper after Different Severe Plastic Deformation Schemes

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Abstract:

The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicrocrystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicrocrystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.

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Periodical:

Materials Science Forum (Volumes 558-559)

Pages:

189-194

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.558-559.189

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Online since:

October 2007

Authors:

Sergey V. Dobatkin, Gennady A. Salishchev, A.A. Kuznetsov, T.N. Kon'kova

Keywords:

Accumulative Roll Bonding (ARB), Copper (Cu), Equal-Channel Angular Pressing (ECAP), Multiaxial Deformation, Severe Plastic Deformation (SPD), Submicrocrystalline Structure

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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