Paper Titles
Preface
Recent Advances in the Simulation of Recrystallization and Grain Growth
p.3
Deformation Substructures and Recrystallisation
p.13
Role of Heavy Deformation in Thermomechanical Processing on the Formation of Ultrafine-Grained Structure in Steels
p.23
An Overview of Accomplishments and Challenges in Recrystallization and Grain Growth
p.33
Relation between Initial Texture and Microstructure and Nucleation and Growth Mechanisms in Metals
p.45
Boundary Mobilities during Recovery and Recrystallization of Binary Al - Mn Alloys
p.53
The Development of Homo and Heterogeneous Rolling Microstructures in Rolled Low Carbon and Interstitial-Free Steel
p.61
Relation between Ridging and Texture Components in Al-Mg-Si Alloy
p.71

Recent Advances in the Simulation of Recrystallization and Grain Growth

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Abstract:

Modeling and simulation of recrystallization, grain growth, and related phenomena are important tools for the fundamental understanding of microstructural evolution and prediction of engineering properties. In particular for ultra fine grained and nanocrystalline materials proper account of microstructural evolution is essential for the optimal processing of these materials. It is shown that for modeling of softening phenomena it is important to discriminate between discontinuous primary recrystallization and discontinuous grain growth owing to their quite different underlying physics. Recent developments in recrystallization modeling and simulation of grain growth are addressed, in particular nucleation of recrystallization and junction effects in grain growth. Major progress is also expected from atomistic modeling and quantum-mechanical computations for making available specific material properties.

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Periodical:

Materials Science Forum (Volumes 558-559)

Pages:

3-12

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.558-559.3

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Online since:

October 2007

Authors:

Günter Gottstein, Lasar S. Shvindlerman, Mischa Crumbach, L.A. Barrales-Mora

Keywords:

Grain Boundary Junctions, Grain Growth Kinetics, Nucleation, Simulation

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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