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The Influence of Surfactant CTAB on the Microstructure and Material Properties of Nickel Microelectroforming

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Abstract:

The influence of surfactant CTAB (cetyl trimethyl ammonium bromide) on electrodeposited nickel layer has been investigated in this research. Our result shows that CTAB added in the electrolysis bath can effectively remove the hydrogen to obtain a smoother nickel layer. The effect of CTAB on the surface roughness is also significant. It may be ascribed to the adsorption of CTAB on the electrode surface which results in a hindering effect in the electrodeposition process. Increasing the concentration of CTAB, the grain size of nickel deposit was reduced and the microhardness of the nickel deposit was therefore improved. The hardness of the metal layer can be promoted to 450 Hv when 300 ppm CTAB is added.

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Periodical:

Key Engineering Materials (Volumes 364-366)

Pages:

346-350

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.364-366.346

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Online since:

December 2007

Authors:

Yann Cheng Chen, Sheng Lung Kuo, Jeou Long Lee, Shih Tsung Ke, Chia Hao Wong, Ming Der Ger

Keywords:

Cetyl Trimethyl Ammonium Bromide (CTAB), Corrosion Resistance, Electrochemical Spectrosopy, Electrodeposition of Nickel

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] R. Weil and W.N. Jacobus Jr: Plating Vol. 53 (1966), p.102.

Google Scholar

[2] T.A. Costavaras, M. Froment, A.H. -Le Goff and C. Georgoulis: J. Electrochem. Soc. Vol. 120 No. 7 (1973), p.867.

DOI: 10.1149/1.2403589

Google Scholar

[3] St. Rashkov and N. Atanasov: Electrodeposition Surf. Treat. Vol. 3 No. 2 (1975), p.105.

Google Scholar

[4] J. Amblard, I. Epelboin, M. Froment and G. Maurin: J. Appl. Electrochem. Vol. 9 No. 2 (1979), p.233.

Google Scholar

[5] Y. Nakamura, N. Kaneko, M. Watanabe and H. Nezu: J. Appl. Electrochem. Vol. 24 No. 3 (1994), p.227.

Google Scholar

[6] S.H. Wu and D.H. Chen: J. Colloid and Interface Sci. Vol. 273 No. 1 (2004), p.165.

Google Scholar

[7] F. Li, C. Vipulanandan and K.K. Mohanty: Colloids and Surfaces A, Physicochemical and Engineering Aspects Vol. 223 No. 1-3 (2003), p.103.

Google Scholar

[8] Y. Jia, T. Wiliana; K. Chen, Z. Yun, Tam, C. Kam, J. Ma and S. Bernard: J. Materials Chemistry, Vol. 13 No. 12 (2003), p.3053.

Google Scholar

[9] Y.Y. Lim and K.H. Lim: J. Colloid and Interface Sci. Vol. 196, No. 1 (1997), p.116.

Google Scholar

[10] R. Vittal, H. Gomathi and G.P. Rao: Electrochimica Acta Vol. 45, No. 13 (2000), p. (2083).

Google Scholar

[11] T.Y. Soror and M.A. El-Ziady: Mater. Chem. Phys. Vol. 77, No. 12, (2003), p.697.

Google Scholar