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Research on Quick Polishing of CVD Diamond Film

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Abstract:

Polycrystalline CVD diamond film possesses many advanced physical and mechanical properties which makes it a very important engineering material. However, high hardness value and extreme brittleness have made CVD diamond film a very difficult material to be machined by conventional grinding and polishing processes. In the present research, diamond wafers were pretreated with RIE in an attempt to weaken the top layer and pave the way for subsequent thermochemically polishing. It was found that the diamond grains were anisotropically etched and some high aspect ratio pillar-like micro-structures were formed during the RIE process. These micropillars are relatively easy to be ruptured and removed by the subsequent polishing process. The results showed that this method could effectively speed up the polishing of CVD diamond films.

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Periodical:

Key Engineering Materials (Volumes 364-366)

Pages:

668-673

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.364-366.668

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Online since:

December 2007

Authors:

Choung Lii Chao, Wei Haw Fan, Wen Chen Chou, Chun Yu Chien, Hung Yi Lin, Jaime G. Duduch

Keywords:

CVD Diamond Film, Reactive Ion Etching, Thermal Chemical Polishing

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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