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A Method to Improve Uniformity of Material Removal of Chemical Mechanical Polishing in LCOS Process

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Abstract:

LCOS panel as a kind of new LCD is a sort of liquid crystal display device that operates in a reflective mode. In this paper, a method on realising planarization in large scale liquid crystal on silicon with chemical mechanical polishing (CMP) technology is discussed in detail. The nonuniform distributions of polishing pressure and the relative speed between the wafer and the polishing pad are main factors affecting the within-wafer non-uniformity. This research integrated a physical mixed model of chemical-mechanical polishing that combineed the effects of polishing pad roughness and slurry hydrodynamic pressure. Based on the contact mechanics and modified Reynolds equation, the asperity contact and fluid flow pressures were calculated. Taking into account the effects of kinematic parameters, the material removal rate(MRR) on silicon panel front surface was obtained. In the last section the design of a schematic carrier with multi-zone, in which the compensation back pressure can be applied, is presented. The model and the design can be used for providing theoretical guide to the development of CMP equipments and selection of the kinematic variables in CMP process.

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Periodical:

Key Engineering Materials (Volumes 364-366)

Pages:

686-689

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.364-366.686

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Online since:

December 2007

Authors:

Yu Hui Sun, Ren Ke Kang, Dong Ming Guo

Keywords:

Chemical Mechanical Polishing (CMP), LCOS, Material Removal, Multi-Zone Carrier

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin, J. Electrochem. Soc. Vol. 144 (1997), P. 1121.

Google Scholar

[2] S.R. Runnels, L.M. Eyman, J. Electrochem. Soc. Vol. 141 (1994),P. 1698.

Google Scholar

[3] Q. Jane Wang, Dong Zhu, Mixed Lubrication Analyses by a Macro-Micro Approach and a FullScale Mixed EHL Model , Journal of Tribology, JANUARY, Vol. 126 (2004),P. 81.

DOI: 10.1115/1.1631017

Google Scholar

[4] Greenwood, J. A., and Williamson, J. B. P., Contact of Nominally Flat Rough Surfaces, Soc. Vol. 295 (1966), P. 300.

Google Scholar

[5] Hamrock: Fundamentals of Fluid Film Lubrication, (McGraw-Hill Publications, U.S. 1994).

Google Scholar

[6] Patir, N., and Cheng, H., An Average Flow Model for Determining Effects of Three Dimensional Roughness on Partial Hydrodynamic Lubrication, ASME . Vol. 100 (1978), P. 12.

DOI: 10.1115/1.3453103

Google Scholar