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Microstructures of Ni/Cu and Ni-Co/Cu Multilayers Produced by Electrodeposition Method

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Abstract:

Microstructures of Ni/Cu and Ni-Co/Cu multilayers were investigated by X-ray diffraction analysis. These multilayered structures were fabricated on copper substrates using electrodeposition technique. At an as-deposited Ni/Cu multilayer with the layer thickness of h=5nm, a single diffraction peak appeared, although the multilayer of h=100nm exhibited the diffractions splitting into two peaks which resulted from both the Ni and Cu layers. In the Ni-Co/Cu multilayers, it was found that composition of the Ni-Co layer depended on an electric potential applied during deposition. The fcc and hcp structures were detected at the Ni-rich and the Co-rich deposits, respectively. The Vickers hardness of the Co-Ni/Cu multilayer was higher than that of the Ni/Cu multilayer.

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Periodical:

Advanced Materials Research (Volumes 26-28)

Pages:

1321-1324

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.26-28.1321

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Online since:

October 2007

Authors:

Yoshihisa Kaneko, T. Sanda, Satoshi Hashimoto

Keywords:

Electro-Deposition, Multilayer, Nanostructured Materials, Ni-Co/Cu, Ni-Cu, X-Ray

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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