Paper Titles
Metallurgical Nature at the Interface between Tool Shoulder and Workpiece during Friction Stir Welding
p.43
Multifarious Fracture Features of CuZrAlGd(Ag) Bulk Metallic Glasses
p.47
Biomechanical and Biocorrosion Properties of Nanostructured Titanium
p.51
Characterization of Indentation Size Effect of Hardness Using a Loading Curve from Crystalline Materials
p.55
The Effect of Additives and Substrate Conditions on the Copper Electrodeposition for Thin Film Applications
p.59
Surface Characteristics of the Anodized and Hydrothermally Treated Titanium Affected by the Current Density, Voltage, and Time
p.63
Surface Characterization of an Extruded 6060 Al Alloy
p.67
Mechanical Properties of Directionally Arrayed Dendrites in the Ni3Al Matrix Alloy
p.71
Mechanical Properties of Micro-Porous Metals Produced by Space-Holding Sintering
p.75

The Effect of Additives and Substrate Conditions on the Copper Electrodeposition for Thin Film Applications

Article Preview

Abstract:

The effect of surface states of substrate and additives on copper electrodeposition for thin film applications was investigated. Titanium substrate states were mechanically and chemically moderated and several additives such as Arabic gum, hydroxyl ethyl cellulose, and chlorine were used during electrodeposition process under a constant current condition with current density of 500 mA/cm2. Results obtained using SEM, X-ray, and AFM for early stage of copper nucleation and growth revealed that substrate conditions and additives appear to be effective in producing uniformly-distributed copper nuclei and their subsequent growth in a regulated manner of surface leveling. The shape of copper nuclei was clearly affected by the surface state of the substrate. It seems to be related with dislocations produced on the titanium cathode during surface moderating. Hardness, growth direction, and resistivity of copper deposits changed with the kind of additives.

You might also be interested in these eBooks
Advanced Materials and Processing IV View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 29-30)

Pages:

59-62

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.29-30.59

Citation:

Cite this paper

Online since:

November 2007

Authors:

T.G. Woo, Kyeong Won Seol, Il Song Park, H.W. Lee, K.N. Woo, W.Y. Jeon

Keywords:

Anodizing, Arabic Gum, Chlorine, Electro-Deposition, HEC, Titanium Substrate

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] J. O'M. Bockris and A.K.N. Reddy: Modern Electrochemistry (Plenum Press, U.S.A. 1970).

Google Scholar

[2] Y.K. Lee and T.J. O'Keefe: JOM April (2002), p.40.

Google Scholar

[3] K.W. Seol, B.H. Choe, Y.K. Lee and J.K. Lee: Mater. Sci. Forum Vol. 426-432 (2003), p.3715.

Google Scholar

[4] H.W. Schadler: Acta Metall. Vol. 12 (1964), p.861.

Google Scholar

[5] H. Sun, J.L. Delplancke, R. Winand and T.J. O'Keefe: Copper 91-Cobre 91 International Symposium Vol. 3 (1999), TMS, Warrendale, p.495.

Google Scholar

[6] H.K. Chang, B.H. Choe and J.K. Lee: Mater. Sci. Eng. A Vol. 409 (2005), p.317.

Google Scholar

[7] K.S. Teng, J.L. Delplancke, J. Zhang and T.J. O'Keefe: Met. Mater. Trans. Vol. 29B (1998), p.749.

Google Scholar

[8] H. Habazaki, M. Uozumi, H. Konnon, K. Shimizu, J. Corros. Sci. Eng. Vol. 6 (2004), p.107.

Google Scholar