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HomeMaterials Science ForumMaterials Science Forum Vols. 204-206Formation of Slip Traces during Grain Growth of...

Formation of Slip Traces during Grain Growth of Thin Metal Sheets

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Grain Growth in Polycrystalline Materials II

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Periodical:

Materials Science Forum (Volumes 204-206)

Pages:

399-404

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.204-206.399

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Online since:

March 1996

Authors:

H. Lin, D.P. Pope

Keywords:

Cu, Grain Growth, Ni₃Al, Nickel Ni, Plastic Deformation, Recrystallization RX, Residual Strains, Residual Stress, Slip Trace, Thermal Grooves, Thin Metal Sheets

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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