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HomeKey Engineering MaterialsKey Engineering Materials Vols. 164-165Creep at the Mesoscopic and Microscopic Scale of...

Creep at the Mesoscopic and Microscopic Scale of 2.5D C_f-SiC

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High Temperature Ceramic Matrix Composites III

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Periodical:

Key Engineering Materials (Volumes 164-165)

Pages:

313-316

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.164-165.313

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Online since:

July 1998

Authors:

G. Boitier, Jean Vicens, Jean-Louis Chermant

Keywords:

C_f-SiC, Fiber Pull-Out, Interfacial Rupture, Interfacial Sliding, Matrix Microcracking

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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