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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Processing and Properties of Cu Matrix Composites...

Processing and Properties of Cu Matrix Composites for Microelectronic Application

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

2199-2206

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.2199

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Online since:

August 2003

Authors:

Yong Jin Kim, Jung Ho Ahn, Hyung Sik Chung

Keywords:

Copper Alloy, Metal Matrix Composite (MMC), Microelectronics, Powder Processing, Thermal Property

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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