Effect of Sb Addition on Microstructure and Shear Strength of Sn-Ag Solder Joints

H.T. Lee; C.L. Yang; Ming He Chen; C.S. Li

doi:10.4028/www.scientific.net/KEM.261-263.501

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 261-263Effect of Sb Addition on Microstructure and Shear...

Effect of Sb Addition on Microstructure and Shear Strength of Sn-Ag Solder Joints

Abstract:

The effect of Sb addition on microstructure, intermetallic compound (IMC) and mechanical properties of Sn-Ag solder joints is investigated. The compositions of selected solders are Sn2.58Ag, Sn2.82Ag1.75Sb, Sn2.87Ag4.75Sb and Sn2.7Ag8.78Sb. Experimental results show that most of the added Sb are solved in -Sn matrix, and the rest react with the Ag3Sn to form Ag3(Sb,Sn) phase, which contributes to suppress the coarsening of Ag3Sn phase. SbSn phase can be observed in β-Sn matrix as the Sb addition exceeds 4.75% and remains stable during the thermal storage test. The solder microhardness increases with increasing Sb. And the growth rate of interfacial IMC layer decreases as Sb addition increases. EPMA analysis indicates there are some Sb diffusing into the interfacial IMC layer. Shear strength of solder joints are raised by adding Sb. The shear strength by as-soldered condition are 27.8MPa (0%Sb), 29MPa (1.75%Sb), 30.4MPa (4.75%Sb) and 43.4MPa (8.78%Sb) respectively

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Periodical:

Key Engineering Materials (Volumes 261-263)

Pages:

501-506

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.261-263.501

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Online since:

April 2004

Authors:

H.T. Lee, C.L. Yang, Ming He Chen, C.S. Li

Keywords:

IMC, Intermetallic Compound (IMC), Shear Strength, Sn-Ag-Sb Solder, Thermal Storage

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