Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films

I. Jeon; Yong Bum Park; Hisahiro Inoue; Kikuo Kishimoto

doi:10.4028/www.scientific.net/KEM.261-263.507

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Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films

Abstract:

The volume-averaged hydrostatic parts of thermo-mechanical stresses in the metal interconnect line determined by XRD method and finite element method are compared with each other. Two typical shapes of passivated Al-0.5%Cu thin film with SiN or FOx(Flowable Oxide) are selected for this study. For the numerical calculation, the stress concentration effect around the edge of Al-Cu thin film and elastic-plastic behavior of the film following its hardening rule are considered. For the stress obtained by XRD, the experimental results of Park and Jeon[Microelectron. Eng., 69 (2003) p.26] are introduced. A good agreement is found between the volume-averaged hydrostatic stresses obtained from each method.