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Morphology of Copper Coatings Electroplated in an Ultrasonic Field

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Periodical:

Materials Science Forum (Volumes 455-456)

Pages:

844-848

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.455-456.844

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Online since:

May 2004

Authors:

L. Martins, J.I. Martins, A.S. Romeira, Maria Elisabete V. Costa, José Domingos M. Costa, M. Bazzaoui

Keywords:

Adhesion, Copper (Cu), Electro-Deposition, Hardness, Ultrasound (US)

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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