Paper Titles
Influence of Boronizing on Mechanical Properties of EN-C35E Steel
p.629
Surface Modification of EN-C35E Steels by Thermo-Chemical Boronizing Process and its Properties
p.633
A Simple Approach to Synthesize and Bond Organosiloxane Films on Injection-Molded Polyolefins
p.637
Silicon Nitride Films Deposited by Low Pressure Chemical Vapor Deposition from SiH4-NH3-N2 System
p.643
Joining Mechanisms in Electrostatic Bonding
p.649
Reactive Joining of Alumina by Oxidation of Al Interlayers
p.655
Friction Welding of Functionally Graded Composites
p.659
Profiled Metal-Ceramic Micropackages for Power Microwave Diodes
p.663
Mechanism of Adhesion at Solid State Bonding Ceramic-Metal: Case of Silver-Alumina Couple
p.667

Joining Mechanisms in Electrostatic Bonding

Article Preview

Abstract:

You might also be interested in these eBooks
Euro Ceramics VIII View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 264-268)

Pages:

649-654

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.264-268.649

Citation:

Cite this paper

Online since:

May 2004

Authors:

A.T.J. Van Helvoort, K.M. Knowles, J.A. Fernie

Keywords:

Aluminum (Al), Bonding Mechanism, Electrostatic/Anodic Bonding, Pyrex, Silicon, TEM

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2004 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] G. Wallis and D.I. Pomerantz: J. Appl. Phys., Vol. 40 (1969), p.3946.

Google Scholar

[2] D.O. Myers: United States Patent, 4, 384, 899 (1983).

Google Scholar

[3] A.R. Mirza and A.A. Ayon: Sensors, Vol. 15 (December, 1998), pp.24-33.

Google Scholar

[4] D-J. Lee, Y-H. Lee, J. Jang and B-K. Ju: Sensors and Actuators A, Vol. 89 (2001), p.43.

Google Scholar

[5] T.T. Veenstra, J.W. Berenschot, J.G.E. Gardeniers, R.G.P. Sanders, M.C. Elwenspoek and A. van den Berg: J. Electrochem. Soc., Vol. 148 (2001), p. G68.

DOI: 10.1149/1.1339873

Google Scholar

[6] P. Nitzsche, K. Lange, B. Schmidt, S. Grigull, U. Kreissig, B. Thomas and K. Herzog: J. Electrochem. Soc., Vol. 145 (1998), p.1755.

DOI: 10.1149/1.1838553

Google Scholar

[7] T.R. Anthony: J. Appl. Phys., Vol. 54 (1983), p.2419.

Google Scholar

[8] W.Y. Lee, F. Sequeda, D. Chapman and J. Salem, Appl. Phys. Lett., Vol. 50 (1987), p.522.

Google Scholar

[9] A.T.J. van Helvoort, K.M. Knowles and J.A. Fernie: J. Electrochem. Soc., in the press (2003).

Google Scholar

[10] A.T.J. van Helvoort, K.M. Knowles and J.A. Fernie: J. Am. Ceram. Soc., in the press (2003).

Google Scholar

[11] A.T.J. van Helvoort, K.M. Knowles and J.A. Fernie: submitted for publication (2003).

Google Scholar

[12] A. Cozma and B. Puers: J. Micromech. Microeng., Vol. 5 (1995), p.98.

Google Scholar

[13] T.M.H. Lee, D.H.Y. Lee, C.Y.N. Liaw, A.I.K. Lao and I. -M. Hsing: Sensors and Actuators A, Vol. 86 (2000), p.103.

Google Scholar

[14] A.T.J. van Helvoort, K.M. Knowles, C.B. Boothroyd and J.A. Fernie: Inst. Phys. Conf. Ser., No. 168 (2001), p.341.

Google Scholar

[15] M.A. Morsy, K. Ikeuchi, M. Takahashi and M. Ushio: Proc. Trends in Welding Research, 5th International Conference, Pine Mountain, Georgia, U.S.A. (1998) p.251.

Google Scholar

[16] Q. Xing, M. Yoshida and G. Sasaki: Scripta Materialia, Vol. 47 (2002), p.577.

Google Scholar

[17] Q. Xing, G. Sasaki and H. Fukunaga: J. Mat. Sci.: Materials in Electronics, Vol. 13 (2002), p.83.

Google Scholar

[18] D.E. Carlson, K.W. Hang and G.F. Stockdale: J. Am. Ceram. Soc., Vol. 55 (1972), p.337.

Google Scholar

[19] U.K. Krieger. and W.A. Lanford: J. Non-Cryst. Sol., Vol. 102 (1988), p.50.

Google Scholar

[20] J.A. Plaza, E. González, J. Esteve, M.M. Visser, D.T. Wang and A. Hanneborg: Electrochem. SolidState Lett., Vol. 3 (2000), p.392.

Google Scholar