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Influence of Oxygen Content on the Static Recrystallization of ETP Copper
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Influence of Oxygen Content on the Static Recrystallization of ETP Copper

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Abstract:

Cold-drawn Electrolytic Tough Pitch copper wires have been investigated with Neutron Diffraction and Electron Back Scattered Diffraction. The drawn copper wires (38% reduction in area) develop major <111> and minor <001> fiber textures. It appears that the texture intensity of the reinforcements within the <111> and <001> fibers is more pronounced in the center and intermediate part of the wires. During the first annealing time, it is found that the recrystallization kinetics is enhanced when oxygen content is increased. The recrystallized fraction within the intermediate zone of the wire is two times larger in the cathode with higher oxygen content. The mechanisms at the origin of this acceleration of recrystallization kinetics will be discussed taking into account the presence of Cu2O type oxides.

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Periodical:

Materials Science Forum (Volumes 467-470)

Pages:

471-476

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.467-470.471

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Online since:

October 2004

Authors:

S. Jakani, Marie Helene Mathon, Ph. Gerber, Mustafa Benyoucef, C.-H. De Novion, Thierry Baudin

Keywords:

Electron Backscatter Diffraction (EBSD), ETP Copper, Impurity, Neutron Diffraction, Oxide, Recrystallization, Texture

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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