Paper Titles
Preface
Annealing Textures of Thin Films and Copper Interconnects
p.1
Impact of a Combined Use of Focused Ion Beam Technique and Transmission Electron Microscopy on Materials Characterization
p.9
Novel Properties of Nanostructured Metals
p.21
A Unified Technology Combining Plastic Forming and Heat Treatment of Steels
p.31
Structural Refinement of Interstitial Free (IF) Steel by Deformation and Phase Transformation
p.37
Grain Refinement and Mechanical Properties of a Metastable Austenitic Fe-Cr-Ni-Mn Alloy
p.43
Characteristics of Deformation-Enhanced Transformation in Plain Low Carbon Steel
p.49
Corrosion Resistance of Si and Al-Bearing Ultrafine Grained Weathering Steel
p.55

Annealing Textures of Thin Films and Copper Interconnects

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Abstract:

Vapor-, electro-, and electroless-deposits have usually strong fiber textures. When annealed, the deposits undergo recrystallization or abnormal grain growth to reduce their energy stored during deposition. The driving force for recrystallization is mainly caused by dislocations, whereas that for abnormal grain growth is due to the grain boundary, surface, interface, and strain energies. During recrystallization and abnormal grain growth, the texture change can take place. The recrystallization and abnormal grain growth textures are in general of fiber type. However, copper interconnects are subjected to non-planar stress state due to geometric constraints during room temperature and/or elevated temperature annealing. The annealing textures of the thin films and copper interconnects are discussed in terms of the minimization of the surface, interface, and strain energies, the grain boundary energy and mobility, and the strain-energy-release maximization.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

1-8

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.1

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Online since:

January 2005

Authors:

Dong Nyung Lee

Keywords:

Abnormal Grain Growth, Aluminum (Al), Annealing, Chromium, Copper (Cu), Copper Interconnect, Fe-Ni Alloy, Nickel Ni, Ni-Co-P Alloys, Recrystallization, Silver, Texture, Thin Film

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] D.N. Lee: Mater. Sci. Forum 408-412 (2002) 75.

Google Scholar

[2] G. Dehm, T.J. Balk, H. Edongué, E. Arzt: Microelectronic Eng. 70 (2003) 412.

DOI: 10.1016/s0167-9317(03)00395-2

Google Scholar

[3] F. Czerwinski, H. Li, M. Megret, J.A. Szpunar: Scripta Metall. Mater. 37 (1997) (1967).

Google Scholar

[4] Y. -B. Park, J. Park, C.S. Ha, T.H. Yim: Mater. Sci. Forum. This Vol. (2002).

Google Scholar

[5] D.N. Lee, K. -H. Hur: Scripta Mater. 40 (1999) 1333.

Google Scholar

[6] D.N. Lee, K. -H. Hur: Textur. Microstr. 34 (2000) 181.

Google Scholar

[7] A.N. Aleshin, V.Y. Aristov, B.S. Bokstein, L.S. Shvindlerman: Phys. stat. sol. A45 (1978) 359.

Google Scholar

[8] H. -J. Shin, H. -T. Jeong, D. N. Lee: Mater. Sci. Eng. A279 (2000) 244.

Google Scholar

[9] H. Park, D.N. Lee: Metall. Mater. Trans. 34A (2003) 531.

Google Scholar

[10] H. Park, D.N. Lee: Mechanical Properties of Advanced Engineering Materials (Proc. IMMM2003, October 27-31, 2003, Wuhan University of Technology, Wuhan, China), edited by B. Xu, M. Tokuda, G. Sun, Tsinghua University Press, Beijing, pp.13-18.

Google Scholar

[11] D.N. Lee: Scripta Metall. Mater. 32 (1995) 1689.

Google Scholar

[12] D.N. Lee: Thin Solid Films 434 (2003) 183.

Google Scholar

[13] J. -M. Zhang, K. -W. Xu, V. Ji: Applied Surf. Sci. 180 (2001) 1.

Google Scholar

[14] K. -H. Hur, J. -H. Jeong, D.N. Lee: J. Mater. Sci. 25 (1990) 2573.

Google Scholar

[15] Metals Handbook, 9th edition, Vol. 2, ASM, (1979).

Google Scholar

[16] D.N. Lee, H.J. Lee: J. Electronic Mater. 32 (2003) 1012.

Google Scholar

[17] D.N. Lee: Met. & Mater. 2 (1996) 1453.

Google Scholar

[18] Y. -S. Lee, D.N. Lee: J. Mater. Sci. 35 (2000) 6161.

Google Scholar

[19] D.N. Lee, S. Kang, J. Yang: Plating. Surf. Finish. 82 (1995) 76.

Google Scholar

[20] J. -H. Choi, S.Y. Kang, D.N. Lee: J. Mater. Sci. 35 (2000) 4055.

Google Scholar

[21] J.S. Yang, D.N. Lee: Metal. Mater. 5 (1999) 465.

Google Scholar

[22] I. Kim, S.K. Lee: Textur. Microstr. 34 (2000) 159.

Google Scholar

[23] H.S. Nam, D.N. Lee: J. Electrochem. Soc. 146 (1999) 3300.

Google Scholar

[24] S.Y. Kang, D.N. Lee: Mater. Sci. Forum. 408-412 (2002) 895.

Google Scholar

[25] J. Greiser, P. Müllner, E. Arzt: Acta mater. 49 (2001) 1041.

Google Scholar

[26] J.W. Patten, E.D. McClanahan, J.W. Johnston: J. Appl. Phys. 42 (1971) 4371.

Google Scholar