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Parametric Study of Spherical Micro-Lens Array

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Abstract:

This study presents a concept to fabricate micro-lens devices using high-aspect-ratio lithography, extra-hardness electroplating, and hot embossing processes. A bath of electroplating electrolyte will be formulated to fabricate micro-optics mold inserts with extra-hardness Ni-Co alloy. It is a novel method to increase the life of the mold insert during fabricating micro-lens devices. With this high hardness, the mold inserts can resist high abrasiveness and wearness so as to extend the mold cycle life and reduce the idle time of replacing mold plates during fabrications. Therefore, the process of fabrications of micro-lens can be more cost-effective. In this study, parametric effects of reflow time, and temperature on micro-lens profiles will be characterized and discussed. Finally, the optical properties such as focal length of developed micro-lens will be measured and tested.

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Periodical:

Materials Science Forum (Volumes 505-507)

Pages:

595-600

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.505-507.595

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Online since:

January 2006

Authors:

Ruey Fang Shyu, C.T. Pan, S.C. Lin

Keywords:

Extra-Hardness, Micro-Lens, Ni-Co Alloy Electroplating, Optical Measurement

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] Ezell, B., Information Display. A5, 42 (2001).

Google Scholar

[2] Popovic, Z. D., Sprague, R. A. and Connell, G. A. N., Applied Optics. A27, 1281 (1988).

Google Scholar

[3] Hutley, M. C., Journal of Modern Optics. A37, 253 (1990).

Google Scholar

[4] Choi, J. O., Morse, J. A., Corelli, J. C., Silverman J. P. and Bakhru H., J. Vac. Sc. Technol. A6, 3633 (1988).

Google Scholar

[5] Borrelli, N. F., Morse, D. L., Bellman R. H. and Morgon W. L., Applied Optics. A24, 2520 (1985).

Google Scholar

[6] Yang, H., Chao, C. K., Wei, M. K., Lin, C. P., Journal of Micromechanics and Microengineering. A14, 1197 (2004).

Google Scholar

[7] Lin, C. P., Yang, H., Chao, C. K., Journal of Micromechanics and Microengineering. A13, 775 (2003).

Google Scholar

[8] Yang, H., Chou, M. C., Yang, A., Mu, C. K. and Shyu, R. F., Proc. of SPIE. A3739, 178 (1999).

Google Scholar

[9] Yang, H., Pan, C. T. and Chou, M. C., Journal of Micromechanics and Microengineering. A11, 94 (2001).

Google Scholar

[10] Lee, S. K., Lee, K. C. and Lee, S. S., Journal of Micromechanics and Microengineeing. A12, 334 (2002).

Google Scholar

[11] Cox, W.R., Chen, T., Ussery, D., Hayes, D.J., Tatum, J.A. and MacFarlane, D.L., Optics Communications. A123, 492 (1996).

DOI: 10.1016/0030-4018(95)00614-1

Google Scholar

[12] Cox, W.R., Chen, T. and Hayes, D.J., OSA Optics & Photonics News. A12(6), 32 (2001).

Google Scholar

[13] Cox, W.R., Chen, T. and Grove, M.E., Proceedings of SPIE. A4292, 208 (2001).

Google Scholar

[14] Cox, W.R., Chen, T., Ussery, D. W., Hayes, D. J. and Hoenigman, R. F., SPIE Proceedings. A2687, 89 (1996).

Google Scholar

[15] Cox, W.R., Hayes, D. J., Chen, T., Trost, H. J., Grove, M.E., Hoenigman, R.F. and MacFarlane, D.L., IMAPS International Journal of Microcircuits & Electronic Packaging, A20(2), 89 (1997).

Google Scholar

[16] Oppliger, Y. et al., Microelectronic Engineering. A23, 449 (1994).

Google Scholar