Paper Titles

Chemical Mechanical Polishing (CMP) in Magnetic Float Polishing (MFP) of Advanced Ceramic (Silicon Nitride) and Glass (Silicon Dioxide)
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Fuzzy Contact and Its Effect on Thermal Damage in Grinding Processes
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Bifractal Characteristics of Ground Workpiece Surfaces
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Wear Pattern of Coated Carbide Tools in High Speed Threading of a Ni-Cr-Mo Base Steel
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A Study on Surface Quality of Ultraprecision Grinding for Engineering Ceramics
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A Complex Thermal Model for Deep Grinding
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A Study of Turning Operation by Oil-Water Combined Mist Lubrication Machining Method
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Research on Enhancing Heat Transfer in Grinding Contact Zone with Radial Water Jet Impinging Cooling
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Significance of Grinding Temperature in Metal Removal
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 202-203Chemical Mechanical Polishing (CMP) in Magnetic...

Chemical Mechanical Polishing (CMP) in Magnetic Float Polishing (MFP) of Advanced Ceramic (Silicon Nitride) and Glass (Silicon Dioxide)

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Periodical:

Key Engineering Materials (Volumes 202-203)

Pages:

1-14

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.202-203.1

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Online since:

June 2001

Authors:

M. Jiang, R. Komanduri

Keywords:

Chemical Mechanical Polishing (CMP), High Speed Bearing, Magnetic Float Polishing MFP, Silicon Dioxide

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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