Papers by Author: Aurelia Herrmann

Abstract: Thin graded W/Cu coatings plus subsequent heat treatment at 800°C are used to improve the interfacial adhesion between W and Cu. Specimen with ~500 nm thick graded W/Cu coatings were characterized and analyzed after thermal treatment at 550°C, 650°C and 800°C. At 800°C a significant change in the nanostructure is observed. The better adhesion is caused by W/W grain boundary diffusion processes and Oswald ripening of the nanometre-sized grains leading to their interconnection between each other and the W substrate. The phase and texture analysis of graded W/Cu indicates grain growth and diffusion processes of pure W and Cu. The stress analysis shows that the changes in the nanostructure of the W/Cu coatings correlates to the stress relieve of W at temperature starting from 650°C. After cooling of the coating to RT the residue intrinsic tensile stress is caused by thermal mismatches of the substrate and the 100% W layer of the coating.

Abstract: The mechanical properties of a SiC-fiber/copper matrix composite, reinforced with SCS-0 SiC-fibers ( 140µm, Specialty Materials), can significantly be increased by applying a Ti-Ta-C multilayer between fiber and matrix. This interlayer is deposited with a magnetron sputter device directly on the single fibers. By changing the deposition parameters of this sputter process the Ti-Ta-C interlayer can be optimized regarding fiber strength and fiber/matrix adhesion. Experiments with different deposition pressures, bias voltages and layer thickness’ were performed to increase the bond strength and the ultimate tensile strength when compared to the Ti-Ta-C reference sample.