Papers by Author: B. Wang

Abstract: A new high frequency induction brazed monolayer diamond wire saw for cutting aluminum alloy thick plate is developed with the helical continuous cutting edge distance on the wire surface. In order to solve the problems of forming cutting aluminum alloy plates,the brazed diamond wire saw is used to conduct the preliminary cutting tests on the 50 mm aluminum alloy plates on the modified grinder experimental platform.The results indicate that the cutting efficiency of the brazed diamond wire saw is increased with the increasing of the feed tension, the wire saw line speed and the diamond grits size. Furthermore, some cutting chips shape of the aluminum alloy is presented based on experimental cutting.

Abstract: Boron-doped (B-doped) silicon nanowires (SiNWS) have been prepared and characterized by Raman scattering and photoluminescence (PL). B-doped SiNWS were grown by plasma enhanced chemical vapor deposition (PECVD), using diborane (B2H6) as the dopant gas. Raman spectra show a band at 480cm-1,which is attributed to amorphous silicon. Photoluminescence at room temperature exhibits three distinct emission peaks at 1.34ev,1.42ev,1.47ev. Possible reason for these is suggested. PACS: 36.40._c; 81.15.Gh; 81.20._n