Papers by Author: B.X. Dong

Abstract: This paper investigates two kinds of grinding wheels prepared by the combination of mechanical alloy and hot-press sintering (MA-HPS). Scanning electro microscopy, Optical microscope, Talysurf surface profiler, X-Ray diffraction and Raman spectroscopy were used to characterize two kinds of grinding wheels and identify the removal mechanism. It was found that FeNiCr matrix-TiC (FMT) grinding wheel yielded higher removal rate than TiAl abrasiveless carbophile (TAC) grinding wheel, which conversely owned good polishing quality; diamond was removed by transformation diamond to non-diamond carbons and then removed by mechanically or diffusion to grinding wheel during polishing process with FMT grinding wheel. While TAC grinding wheel polishing CVD diamond film mainly depended on the reaction between diamond carbon and titanium.

Abstract: Although various diamond polishing techniques have been studied for many years, no individual method can polish free-standing CVD diamond film with high efficiency and high polishing quality. This paper investigates polishing CVD diamond film by the combination of electro-discharge machining (EDM) and chemical mechanical polishing (CMP). Scanning electro microscopy, Optical microscopy, Energy dispersive X-ray analysis, Talysurf surface profiler and Raman spectroscopy were used to evaluate the surface integrity and quality of diamond film before and after polishing. Based on the experimental results, the material removal during EDM process can be a chemo-mechanical process, including gasification, melting, sputtering, oxidation and graphitization. While in CMP process, diamond was removed under the mechanical and tribochemical interaction. The combination of EDM and CMP has advantages of high efficiency, high polishing quality and low damage. It is suitable to polish large area free-standing CVD diamond film.