Papers by Author: Bee Lyong Yang

Abstract: ZnO nanowalls and nanocolumns were synthesized on Si3N4 (50 nm)/Si (001) substrates at low growth temperature (350 and 400 oC) by metalorganic chemical vapor deposition (MOCVD) with no metal catalysts. ZnO nanowalls with extremely small wall thicknesses below 10 nm and nanocolumns with diameters over 100 nm were formed on the Si3N4/Si substrates relying on MOCVD-growth temperature. It was found that ZnO nanowalls have a strong c-axis preferred orientation with a hexagonal structure, while ZnO nanocolumns have a weak c-axis preferred orientation with broken stacking orders in synchrotron x-ray scattering experiments. In addition, strong free-exciton emission from the ZnO nanowalls was clearly observed in photoluminescence measurements. On the other hand, we could not observe any emission bands from the ZnO nanocolumn samples.

Abstract: TiN thin films are widely used as a coating material due to their good mechanical and conductivity properties, high thermal properties, strong erosion and corrosion resistance. Also TiN has been used in Si devices as a diffusion barrier material for Al and Cu-based metallization. The uniform and dense structure of thin films is influenced by the texture of films. It was good to have uniform and dense structure and bad to have an open columnar structure in TiN thin films. Therefore, the property of diffusion barrier of the TiN films in semiconductor also is related to the texture and microstructure of TiN coated layer. In this study, the relationship between the texture and microstructure and the best diffusion barrier propertiy of TiN coated films (by PVD and MOCVD) on semiconductor devices (Cu/TiN/SiO2/Si layer) were investigated under different processing conditions and textures. The property of diffusion barrier for Cu of physical vapor deposited TiN thin films is better than that of metal organic chemical vapor deposited TiN thin films. Also the property of diffusion barrier for Cu of (111) textured TiN thin films is better than that of (200) textured TiN thin films.

Abstract: The uniform and dense structure of thin films is influenced by the texture of films. It was good to have uniform and dense structure and bad to have an open columnar structure in TiN thin films. Therefore, the property of diffusion barrier of the TiN films in semiconductor also is related to the texture and microstructure of TiN coated layers. In this study, the relationships between the textures and microstructures and the properties of TiN films on semiconductor were investigated under different processing methods (PVD and MOCVD). The property of diffusion barrier of RF sputtered (PVD) TiN is better than that of metal organic chemical vapor deposited (MOCVD) TiN thin films. Also the property of diffusion barrier of PVD (111) textured TiN is better than that of PVD (100) textured TiN thin films on oxidized Si wafer.