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Articles by author: Cha Yong Lim

• Deformation Behavior of Functionally Graded Ti-Ni Shape Memory Alloys
  Published in: Eco-Materials Processing and Design VIII (p211)
• Difference in Annealing Characteristics of Nanostructured Copper Alloys Processed by Accumulative Roll Bonding
  Published in: Advances in Nanomaterials and Processing (p1373)
• Effect of Stacking Layer Number on Mechanical Properties of Accumulative Roll Bonding Processed Aluminum
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p161)
• Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process
  Published in: Advanced Welding and Micro Joining / Packaging for the 21st Century (p71)
• Fabrication of High Mg Containing Al-Mg Alloy Sheets by Twin Roll Strip Casting
  Published in: Advanced Materials and Processing IV (p83)
• Grain Refinement of Copper Alloys by Equal Channel Angular Pressing
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p177)
• Mechanical Properties of SPD (Severe Plastic Deformation) Processed Copper
  Published in: PRICM-5 (p3497)
• Microstructural Characteristics of Cu-Fe-P Alloys Severely Deformed by Accumulative Roll Bonding Process
  Published in: THERMEC 2006 (p2849)
• Microstructure Evolution and Hardening Behavior of 2024 Aluminum Alloy Processed by the Severe Plastic Deformation
  Published in: Aluminium Alloys 2002 - ICAA8 (p1163)
• Nano-Structured High Purity Copper Processed by Accumulative Roll-Bonding
  Published in: The Science of Engineering Ceramics III (p239)
• Tensile Properties and Fatigue Strength of Ultrafine Grained Pure Copper
  Published in: Progresses in Fracture and Strength of Materials and Structures (p1649)