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Papers by Author: Chao Kun Hu

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Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects

Authors: D. Gupta, Chao Kun Hu, K.L. Lee

1397

Atom Movement in Lead and Lead Tin Solders

Authors: H.B. Huntington, Chao Kun Hu

29