Papers by Author: D. Ščekaturovienė

Abstract: Components of navigating devices can be affected by acoustic emission and vibration. Therefore prototype samples and electronic components must be tested in such conditions. Heterostructures, which destructed under the action of external physical factors and kinetics of formations of porous defects in silicon substrates, were analyzed.

Abstract: The influence of thermal cyclic overloads on mechanical properties of winding conductors was investigated. Copper-niobium microcomposite, soft and hard pure copper wires were conditioned at temperatures range from 77 K to 500 K. The treatment was done during 100 cycles of fast conductor cooling to liquid nitrogen temperature and further fast heating in a climatic chamber. The ultimate tensile stress limit and the elongation at failure of metal-matrix copper-niobium microcomposite, soft and hard copper wires were measured before and after thermal treatment with a testing machine at room temperature.