Papers by Author: Denis Bouscaud

Abstract: The Kossel microdiffraction in a scanning electron microscope allows for local stress determination. This technique has been applied to monitor stress evolution within grains of austenite in the course of martensitic transformation in a shape memory alloy. Kossel diffraction patterns were recorded during in situ tensile straining of Cu-Al-Be alloy. These innovative measurements show large stress heterogeneities between grains, with the stress ratio exceeding two. As martensite variants are stress-induced, shear stress components appear in individual grains of austenite.

Abstract: The GFAC (French Association for residual stress analysis) decided in 2007 to work on external reference samples for residual stress analysis by X-ray diffraction as defined in the XPA 09-285 and EN 15305-2009 standards. Seven materials are studied: ferritic steel, martensitic steel, aluminium alloy, titanium alloy, 2 types of Nickel-Chromium alloy and tungsten thin layers deposited on silicon wafers. The purpose of this external round robin campaign is threefold: (i) to give possibilities for each laboratory involved in the campaign test to obtain external reference samples for each material tested, (ii) to validate a common procedure for qualification of external samples and (iii) to commercialise validated external reference samples through the GFAC association. A common approach of X-Ray diffraction parameters, samples geometry and standard procedure has been chosen and adopted by each laboratory involved in these tests. No indication in terms of residual stress calculation method is given; the choice of the method (centroid, middle point, maximum of peak, fitting…) is the choice of the laboratory according to their X-ray diffraction set-ups, softwares and experience. Once all samples are analysed, values given by each laboratory are compared and analysed.

Abstract: A Kossel microdiffraction experimental set up is under development inside a Scanning Electron Microscope (SEM) in order to determine the crystallographic orientation as well as the inter- and intragranular strains and stresses. An area of about one cubic micrometer can be analysed using the microscope probe, which enables to study different kinds of elements such as a grain boundary, a crack, a microelectronic component, etc. The diffraction pattern is recorded by a high resolution Charge-Coupled Device (CCD) camera. The crystallographic orientation, the lattice parameters and the elastic strain tensor of the probed area are deduced from the pattern indexation using a homemade software. The purpose of this paper is to report some results achieved up to now to estimate the reliability of the Kossel microdiffraction technique.