Papers by Author: Dong Kil Shin

Abstract: A free-standing photosensitive polyimide film with thickness of 10µm is fabricated with the different curing temperatures using a micro fabrication process. The microtensile specimens of a strip type are made to facilitate a tensile testing. The Young’s modulus and yield strength of photosensitive polyimide film are measured with various strain rates from 10-4 /s to 10-3 /s by using a microtensile test. Also, the hardness and Young’s modulus of polyimide films are obtained from nanoindentation test. Finally, the mechanical properties measured from microtensile test are compared with those from nanoindentation test.

Abstract: In this study, epoxy molded multi chip package was investigated and a highly reliable structure against failure of copper trace on PCB substrate was proposed. Function failure caused by the pattern crack during component level thermal cycle test was considered. In-plane and out-of-plane movements of package during thermal loading were measured by moiré interferometry and shadow moiré. Measured data were compared with numerical analysis results. Two dimensional and three dimensional numerical analysis were performed considering visco-elastic material properties. Tensile stress in the core layer was analyzed quantitatively and qualitatively. Analysis showed that the reliability of pattern crack could be improved by decreasing the chip thickness and increasing the core thickness, and that the material property of die adhesive was important.