Papers by Author: Evgeny I. Gershman

Abstract: Degradation of the mechanical properties of copper and copper based alloys after the treatment with telluride bismuth (Bi2Te3) at 570oC has been studied in the present work. The experiments were performed in a H2 deoxidizing atmosphere. The kinetics of embrittlement of pure copper has been shown to be parabolic. Bi2Te3 was in the solid state and was not in direct contact with the copper specimens during the experiments, i.e. the plating was performed through the gas phase. The brittle fracture along the GB was observed after 3 point bending test. The surface of fracture was investigated with the use AES. It was shown that intergranular penetrations of liquid bismuth and bismuth from Bi2Te3 have different mechanisms.

Abstract: Grain boundary and surface tension for pure copper and copper-based alloys with Sb, Sn and In are measured by zero creep method. On the base of these and literature data, using the Shyshkovsky equation for a dilute solution, the isothermes of surface tension and grain boundary tension are constructed in Cu-based alloys with Sb, Sn, In and also Bi and Au. It is shown that all solutes are active on the surface tension of copper. The free energies of adsorption are negative and decrease in a following consequence: Bi, Sb, Sn, In, and Au.

Abstract: Grain boundary and free surface tension for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution. Grain boundary diffusion coefficients of copper were calculated by using the relation of Borisov et. al. for copper and copper-tin alloys.