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Articles by author: Gang Xiang Hu

• A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer
  Published in: Advances in Materials Manufacturing Science and Technology II (p472)
• A Study on the Grinding Temperature Field for Titanium Alloy
  Published in: Progress of Precision Engineering and Nano Technology (p45)
• Application of the Electrical Discharge Truing Technique on the Lapping Machining Process
  Published in: Advances in Grinding and Abrasive Technology XIII (p94)
• PEELS Study on Dispersion of Volume Plasmons in Bi₂Sr₂CaCu₂O₈
  Published in: Atomic Structures of High-Tc Superconductors (p199)
• The Development of the Precise Double Sided Polishing Machine
  Published in: Advances in Machining & Manufacturing Technology VIII (p375)
• The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer
  Published in: Advances in Grinding and Abrasive Technology XIV (p324)