Papers by Author: Hiroshi Hashimoto

Abstract: Under optimum grinding conditions, a constant grinding force is exerted on a workpiece during ductile-mode grinding of BK7 glass. Based on the results, the cutting force, specific grinding energy, and depth of cut for a single grain were calculated. It was found that a single grain was easily removed from the material. However, grinding is impossible because surface burning occurs on the workpiece. In order to avoid burning, a single-crystal silicon wafer (1,0,0) surface was ground with thrust force directional vibration-assisted grinding. The normal grinding force with vibration was comparatively low, but was quite stable. The removal rate was approximately three times greater than that without vibration. The results indicate that the successive abrasive grains of the grinding wheel remove the material intermittently.

Abstract: In this study, basic experiments involving machining using a rotational tool were conducted with the aim of increasing the volume of material removed rate in ductile-mode machining of Si wafers. The machining surface and machining force was compared to experimentally clarify the material removal process for a single cutting edge, the critical cutting thickness tc at which occurs of cracks was set as the machining condition. Then, the three machining modes were experimentally revealed. As the result, the ductile-mode machining surface was obtained that the total depth of cut was under less than 78.5μm on ductile-brittle-mode machining.