Papers by Author: Hiroyuki Hirakata

Abstract: The dominant mechanics and mechanisms of fatigue crack propagation in approximately 500-nm-thick freestanding copper films were evaluated at three stress ratios, R = 0.1, 0.5, and 0.8. The fatigue crack propagation rate (da/dN) versus stress intensity factor range (ΔK) relation was dependent on the stress ratio (R): da/dN increased with increasing R. Plots of da/dN versus the maximum stress intensity factor (K_max) exhibited coincident features in the high-K_max region (K_max 4.5 MPam^1/2) irrespective of R, indicating that K_max was the dominant factor in fatigue crack propagation. In this region, the fatigue crack propagated in tensile fracture mode, or chisel-point fracture, irrespective of the R value. In contrast, in the low-K_max region (K_max < 4.5 MPam^1/2), da/dN increased with decreasing R. In this region, the fracture mechanism depended on R. At the higher R value (R = 0.8), the fatigue crack propagated in the tensile fracture mode similar to that in the high-K_max region. On the other hand, at the lower R values (R = 0.1 and 0.5), a characteristic mechanism of fatigue crack propagation appeared: within several grains, intrusions/extrusions formed ahead of the crack tip along the Σ3 twin boundaries, and the fatigue crack propagated preferentially through the intrusions/extrusions.

Abstract: The plasticity of a copper (Cu) nano-component is experimentally evaluated by a cantilever specimen with multi-layered structure. The cantilever is monotonically loaded by a diamond tip and the deflection at the free-end is precisely measured by a transmission electron microscope (TEM). The plastic deformation of the Cu nano-component is successfully monitored through the non-linear behavior of applied load, P, and cantilever deflection, δ. The plastic constitutive quation of the Cu component is inversely analyzed by finite element method (FEM) assuming that the component obeys the Ramberg-Osgood law. The parameters in the R-O law (σ0, n and α) are optimally fitted to reproduce the experimentally evaluated P-δ relation. The resultant parameter set is derived as (σ0, n, α) = (345 MPa, 3.2, 1.25). The Cu nano-component has a much higher yield stress and a hardening rate compared with the ones in a bulk Cu.

Abstract: The interface strength of low-dimensional nano-components such as films and islands formed on substrates has been investigated in this project, and the focus is put on the mechanics of crack initiation from the free interface edge and propagation along the interface. The series of experiments elucidates the applicability of fracture mechanics concept on the structures. We proposed experimental methods for evaluating the initiation strength of an interface crack in submicron films and islands deposited on substrates. The initiation is governed by the singular stress field, and the criterion is prescribed by the stress intensity parameter. Using special loading apparatus built in a TEM, we developed a crack initiation method for nano-components and the role of plasticity on the delamination is clarified. Subcritical crack growth along an interface between submicron films under fatigue was also investigated by modified four-point bend method.

Abstract: The transition from SSC to LSC ahead of a crack tip (notch root) or an ordinary interface edge (bad pair) causes stress relaxation and the decrease of stress intensity in general. However, the good pair bi-material and the bad pair bi-material with weak elastic stress singularity in this study show the inverse phenomenon under the transition. The results indicate that the stress near the interface edges of both cases, which have no or low stress singularity at the loading instant, increases and brings about the stress concentration during the transition. In addition, the creep strain distribution in the early stage is different from that occurred in the transition of an ordinary interface edge (bad pair) or a crack tip (notch root).