Papers by Author: J. Zhou

Abstract: A viscoplastic constitutive model with void damage is developed to analyze the macroscopic mechanical response and damage mechanism of lead-free solder alloy in CBGA packaging under cyclic thermal loading. The constitutive model is implemented into ABAQUS through its user defined material subroutine. Two-dimensional nonlinear finite element analysis of a ceramic ball grid array(CBGA) package is conducted to simulate the viscoplastic deformation and damage failure process of the lead-free solder joint under cyclic thermal loading. The damage model is helpful for optimization and reliability of electronic package.