Papers by Author: Jian Yi Cheng

Abstract: The microstructural evolution in Cu-1.5 wt % Ti alloy aged at 400 °C was investigated by high resolution electron microscopy (HREM). The hardness and electrical conductivity of this alloy have been also characterized. The electron metallographic results showed that the sequence of the decomposition in the studied Cu-1.5 wt % Ti alloy can be summarized as follows: a modulated structure resulting from spinodal clustering → formation of clusters and then ordered fcc phase → formation of LRO β’-Cu₄Ti which distributed periodically along the <100>_Cu directions. The ordered fcc phase showed a cube-on-cube OR with matrix, while the LRO β’-Cu₄Ti showed an orientation relationship of [001]_Cu//[001]_β’ and (310)_Cu//(100)_β’. After aging for 24 h, the hardness and electrical conductivity of this alloy reached 175 HV and 25.3 % IACS, respectively. The spinodal clustering is responsible for the hardening of the alloy during the initial 30 min aging. The ordered fcc phase and β’-Cu₄Ti phase makes a significant contribution to the strengthening of the alloy during the advanced stage of aging.

Abstract: Effect of rare earth yttrium on the properties and microstructure of Cu-0.6Cr-0.15Zr-0.05Mg-0.02Si alloy was investigated. The results showed that Cu-0.6Cr-0.15Zr-0.05Mg-0.02Si alloy obtained good comprehensive performance after 80% deformation and then aging at 480°C for 1h, the hardness and electrical conductivity reached 152HV and 85.5%IACS, respectively. The aging time of Y-containing alloy for attaining peak hardness was postponed and the precipitates were finer (2-4nm) and interparticle spacing was shorter than ones of Y-free alloy. The hardness and electrical conductivity of the Y-containing alloy after 80% deformation and then aging at 480°C for 45 min reached 174HV and 82.1%IACS, respectively. The tensile fractures of the two alloys which exhibits the obvious feature of tough fracture.

Abstract: Effect of two-step deforming and aging process on the properties and structure of Cu-Cr-Zr-Mg-Si alloy was investigated. The results show under the condition of same cold deformation, two-step deforming and aging processes can improve overall performance of the alloy. The hardness obtained by two-step deforming and aging process is higher 6%-9% than that by single-step deforming and aging. The hardness and conductivity are up to 160HV and 88.1% IACS respectively after 80 % rolling and reaging at 480°C for 30min. The particles precipitate along the dislocation and pin on the dislocation during the reaging. These finer particles distribute more uniformly in the copper matrix and result in the higher strength and electrical conductivity.