Authors: Jing He Wang, Ming Jun Chen, Shen Dong, Shi Qian Wang
Abstract: In the ultra-precision machining of KDP crystal, there are many factors affecting the
surface quality[1-3]. The experiments show that the rake angle and back angle of the tool have
significant effects on machined surface roughness. Therefore, an efficient way to improve the
surface roughness is to select a proper negative rake angle. In this study, the ANSYS static analysis
method was employed to analyze the stress field distribution within the whole cutting region. A
finite element simulation model was set up to calculate the residual stresses variation with tool’s
angles, which can be considered to select optimal rake and back angles in the ultra-precision
machining of KDP crystal. Results show that the optimal tool rake angle and back angle are -49°
and 7°, respectively. Finally, by using different tool angles to process KDP crystal and utilizing
AFM to analyze the surface roughness, it can be found that the measurement results agree well with
what are deduced from theoretical calculation.
297
Authors: Ming Jun Chen, Qi Long Pang, Jing He Wang, K. Cheng
Abstract: Fractal and wavelet methods have been used in this study to analyze the KDP surfaces
machined by accurate milling and SPDT (Single Point Diamond Turning) method respectively.
Through the 2D wavelet method, the 3D origin machined surfaces were separated into the 3D
overlaying roughness surfaces and 3D material structure surfaces. The overlaying roughness
surfaces were composed of a large number of length scales superimposed roughness surfaces that
are generated from the various vibrations in the machining process. The wavelet method can
analyze the information of spatial frequency (vibrations in the machining process) and fractal
method can reveal the intrinsic properties of roughness topography. Compared with the
conventional methods, the integration of wavelet and fractal is more suitable to characterize the
machined crystal KDP surface.
284
Authors: H.X. Wang, Jing He Wang, Shen Dong
Abstract: Indentation tests and single-point scratch tests are probably the simplest methods of
measuring the elastic, plastic and fracture behavior of brittle materials. In this paper, the nearsurface
mechanical properties of KDP single crystal have been investigated including the elasticity
like Young’s modulus E, and the plasticity like the hardness H. These material properties can be
used to predict the material responses in optical manufacturing operations. Hardness and elastic
modulus on different crystal plane of KDP single crystal have been examined under different loads
by nanoindentation test, and the influence of the indentation load on hardness and elastic modulus
have been also analyzed systematically. The results show the nanoindentation size effect, that is, the
hardness and elastic modulus increase as the indentation load decreases. The hardness and elastic
modulus have strong anisotropy in the different crystallographic orientation of the same crystal
plane.
188
Authors: Ming Jun Chen, Qi Long Pang, Jing He Wang, Kai Cheng
Abstract: 3Dfractal dimension and 2D profile fractal dimension distribution of the surfaces made by
brittle or ductile grinding are calculated. From the calculated results of 3D fractal dimension, it can be
found that the microtopograhpy of ductile ground surface is more exquisite than brittle ground surface
and 3D fractal dimension Ds has inverse relation with the roughness parameter Rq. Through the
analysis of 2D profile fractal dimension distribution in different ground surfaces, it is revealed that the
topography of ground surface is changed with grinding parameters such as ground surfaces may have
weakly or strongly anisotropic even isotropic features when different grinding parameters are adopted.
Using fractal method to analyze the topography of ground surface is helpful to understand the
generating mechanism of surface topography.
523
Authors: Fei Hu Zhang, Hua Li Zhang, Yong Da Yan, Jing He Wang
Abstract: Nanomachining tests have been conducted on single-crystal Al using atomic force
microscope to simulate single-blade machining process of single gain. The influences of
nanomachining experimental parameters (lateral feed and velocity) on the properties of engineering
surface, material removal and chip formation were studied. Results indicated that the cutting depth
of nanomachined surface increased as the lateral feed decreased. Insensitivity of cutting depth to
velocity at same normal load was revealed. The different chip behaviors of nanomachined surface
were investigated through scanning electron microscope (SEM). Results indicated that different
lateral feeds caused different chip behaviors. Three typical chip behaviors were characterized as the
lateral feed increased. In addition, the chip behavior and the volume of material removed were
observed having no evident linear transformation with the evolution of the velocity by SEM
graphics. Furthermore, it was concluded from the chip behaviors in nanomachining process that the
material at high loads was removed by plastic deformation with no fracture or crack happened.
269
Authors: Jing He Wang, Shen Dong, H.X. Wang, Ming Jun Chen, Wen Jun Zong, L.J. Zhang
Abstract: The method of single point diamond turning is used to machine KDP crystal. A
regression analysis is adopted to construct a prediction model for surface roughness and cutting
force, which realizes the purposes of pre-machining design, prediction and control of surface
roughness and cutting force. The prediction model is utilized to analyze the influences of feed,
cutting speed and depth of cut on the surface roughness and cutting force. And the optimal cutting
parameters of KDP crystal on such condition are acquired by optimum design. The optimum
estimated values of surface roughness and cutting force are 7.369nm and 0.15N, respectively .Using
the optimal cutting parameters, the surface roughness Ra, 7.927nm, and cutting force, 0.19N, are
obatained.
78
Authors: H.X. Wang, Bo Wang, Jing He Wang
Abstract: In this work, a coupled thermo-mechanical plane-strain large deformation FE cutting
model is developed to simulate diamond turning based on the updated Lagrangian formulation. As
expected, the effects of friction coefficient on cutting forces, chip deformation, cutting temperature,
flow stresses and shearing angle are investigated by FE simulations. The simulated results can be
adopted as a reference to select the reasonable friction coefficient in diamond turning process.
72
Authors: Ming Jun Chen, Jing He Wang, Ying Chun Liang, D.Y. Yuan
Abstract: Influence of the cutter rake angle to the surface quality of crystal KDP is analyzed
theoretically in this paper. Analysis result shows that the tension stress reaches minimum in the
crystal KDP cutting region and optimal value of the surface quality is obtained as cutter rake angle
is about -45°. Cutting experimental of different cutter rake angle is realized on the machine tool.
Experimental results show that the surface roughness of the crystal KDP reach minimum (rms is
6.521nm, Ra is 5.151nm) as the cutter rake angle is about -45°, this experiment certifies the
correctness of this theory analysis. Theory analysis and experimental results show that influence of
the cutter rake angle to surface quality of the crystal KDP is very large, for ultra-precision
machining of the crystal KDP, when large negative rake diamond cutter (-45°) is adopted, the
super-smooth surface can be obtained.
1
Authors: Ming Jun Chen, Jing He Wang, X.M. Chen, Ying Chun Liang
Abstract: In order to study mechanical property with different crystal-plane and different crystal
orientation of the crystal KDP, nano-indentation experiments are first done. The mechanical
properties of crystal KDP, such as elastic modulus, yielding stress, are obtained from the analysis of
the experimental curve. To obtatin the stress-strain curves of crystal KDP, by using the spherical tip
can get characteristic of continuous strain, the spherical indentation experiments is proposed firstly
and carried out. According to obtained parameters, A finite element cutting model of crystal KDP is
established. The cutting process of crystal KDP is simulated by the model, and the influence of rake
angle and depth of cut on chip and surface quality is studied. The theory shows that when the
cutter’s rake angle is in the range of -40° to -45°, an perfect super-smooth KDP crystal surface will
be obtained. Finaly, the experiments is carried out on special ultra-precision machine tool for crystal
KDP by ourself devoloping. Experiment results show that when the cutter’s rake angle is about -45°,
an super-smooth surface (rms: 6.521nm and Ra: 5.151nm )is obtained on the plane (001), and this
experiment certified correctness of theory analysis.
427
Authors: Jing He Wang, Ming Jun Chen, Shen Dong, H.X. Wang, J.H. Zhang, Wen Jun Zong
Abstract: In this paper, mechanical characteristics of KDP crystal anisotropy are analysed
theoretically. Vickers indentation experiments are adopted to validate the variation rule of hardness
and fracture toughness in different orientation of KDP crystal plane (100), and a model to calculate
critical cutting thickness of brittle-ductile transition is proposed for the KDP crystals. The result
shows that, on the crystal plane (100), the minimum value of critical cutting thickness of KDP
crystal in brittle-ductile transition appears in the direction [110], but the maximum appears in the
direction [010]. Finally, the ultra-precision machining of KDP crystal is performed, and the results
agree well with the theoretical conclusions. Super-smooth surface with a roughness RMS of 6.6nm
is reached as machined in the crystal direction [010], and 11.2nm to the direction [110].
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