Authors: In Jin Shon, Tae Wan Kim, Jung Mann Doh, Jin Kook Yoon, Kwon Il Na, In Yong Ko
Abstract: A dense nanostuctured Fe3Al was consolidated by high frequency induction heated sintering method within 2 minutes from mechanically synthesized powders of Fe3Al and milled powders of 3Fe+Al. The consolidation was accomplished under the combined effects of a induced current and mechanical pressure. The grain size, sintering behavior and hardness of Fe3Al sintered from horizontally milled Fe+Al powders and high energy ball milled Fe3Al powder were compared.
Keywords: Combustion synthesis; Nanomaterials; Mechanical properties; Rapid sintering
759
Authors: In Kyoon Jeong, Hwan Cheol Kim, Jung Mann Doh, Jin Kook Yoon, In Yong Ko, In Jin Shon
Abstract: Two methods, High-Frequency Induction-Heated Sintering (HFIHS) and Pulsed Current
Activated Sintering (PCAS), were utilized to consolidate WC-8wt.%Ni hard materials. The
demonstrated advantages of these processes are rapid densification to near theoretical density in a
relatively short time and with insignificant change in grain size. The hardness, fracture toughness, and
the relative density of the dense WC–8Ni composites produced by HFIHS and PCAS were
investigated. And the effect of variation in particle size of WC powder on the sintering behavior and
mechanical properties were investigated.
1153
Authors: H.Y. Jung, S.H. Lee, J.W. Byeon, Jung Mann Doh, Kyung Tae Hong, H.N. Lim
479
Authors: S.H. Lee, J.W. Byeon, Jung Mann Doh, H.N. Lim, Jin Kook Yoon, H.Y. Jung
Abstract: Effects of 0.5 wt% Sn-addition to the dental casting Au-12Pt-0.6Cu alloy on the
interfacial microstructures and bonding strength between porcelain and the alloy were investigated.
Porcelain powders (SiO2-based oxides) are bonded through a thermal schedule consisting of preoxidation,
1st firing, and 2nd firing. Interfacial microstructures were examined after pre-oxidation
and 2nd firing, respectively, by scanning and transmission electron microscopy. The bonding
strength of the Au-12Pt-0.6Cu and Au-12Pt-0.6Cu-0.5Sn alloys with porcelain was about 24.6 MPa
and 46.2 MPa, respectively. The higher bonding strength of the Sn-added alloy compared with that
of the alloy without Sn is attributed to the SnO2 formed at the interface between porcelain and the
alloy during pre-oxidation. SnO2 layer is thought to enhance chemical bonding with various oxides
in the porcelain and, accordingly, improve bonding strength.
175
Authors: H.Y. Jung, S.H. Lee, Jung Mann Doh, Jin Kook Yoon, H.N. Lim
Abstract: The effect of indium on the microstructures and mechanical properties of a Au-Pt-Cu
alloy was investigated. The Au-Pt-Cu-xIn alloys heat-treated at 550°C for 30 min revealed a maximum hardness value of 207 HV, irrespective of the heat temperature and In contents. Also, the hardness of the Au-Pt-Cu-xIn alloys (x = 0.5, 1.0, 1.5, 2.0) aged at 550 °C rapidly increased with increasing aging time, and it reached an almost constant value after 30 min. The hardness of the Au- Pt-Cu-xIn alloys aged at 550°C for 30 min increased with increasing In content until 1.5wt%, but it
slightly decreased with more increasing In content. Also, a variation of the tensile strength of the alloys with In contents showed a similar trend of hardness change with In contents. Analysis of EDS and TEM revealed that the microstructure of Au-Pt-Cu-xIn alloys is composed of solid solution with fcc structure and intermetallic InPt3 precipitate with L12 structure. Based on this investigation, it can be concluded that an increase in hardness of Au-Pt-Cu-xIn alloys is ascribed to a complex effect of the precipitation hardening of InPt3 and the grain size refinement.
738
Authors: S.H. Lee, H.Y. Jung, Jung Mann Doh, Jin Kook Yoon, H.N. Lim
Abstract: Effects of 0.5 wt% Indium addition on the oxidation of Au-Pt-Cu alloy, the interfacial
microstructure and bonding strength between porcelain and Au-Pt-Cu-xIn alloys(x = 0, 0.5wt%) were investigated using scanning electron microscopy, X-ray diffractometry, transmission electron microscopy, and a tensile tester. The bonding strength of the Au-Pt-Cu and Au-Pt-Cu-0.5In alloys with porcelain was about 24.6 MPa and 49.5 MPa in average, respectively. This higher bonding
strength in the Au-Pt-Cu-0.5In alloy compared with the Au-Pt-Cu alloy without In is ascribed to the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy. Especially, the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy leads to enhancing chemical bonding between In2O3 and various oxides in porcelain, and also to improving the anchoring effect.
282
Authors: M.H. Kim, S.H. Lee, H.N. Lim, Jung Mann Doh, H.G. Baik
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