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Articles by author: Meng Kao Yeh

• Analysis and Experiment of Deformation and Limit Load of Thin-Walled Shell Cavities
  Published in: Advances in Fracture and Materials Behavior (p1207)
• Bending Property of Sandwich Beams with MWNTs/Polymer Nanocomposites as Core Materials
  Published in: The Mechanical Behavior of Materials X (p1265)
• Bending Strength of Sandwich Beams with Nanocomposites Core
  Published in: Multi-Functional Materials and Structures II (p577)
• Delamination Growth in Ball Grid Array Electronic Package
  Published in: Fracture and Strength of Solids VI (p363)
• Dynamic Instability of Delaminated Composite Plates under Parametric Excitation
  Published in: Experimental Mechanics in Nano and Biotechnology (p1765)
• Dynamic Mechanical Properties of MWNTs/Phenolic Nanocomposites
  Published in: Fracture and Strength of Solids VI (p1073)
• Dynamic Properties of MWNTS/Epoxy Nanocomposite Beams
  Published in: Advances in Composite Materials and Structures (p709)
• Electromagnetic Shielding of Multi-Walled Carbon Nanotube/Epoxy Nanocomposites
  Published in: Multi-functional Materials and Structures (p475)
• Fabrication and Characterization of Nanocomposites Reinforced by Carbon Nanotubes-(2)Testing of Mechanical Properties
  Published in: Composite Materials IV (p1)
• Fabrication and Mechanical Properties of MWNTs/Phenolic Nanocomposites
  Published in: Progress on Advanced Manufacture for Micro/Nano Technology 2005 (p121)
• Finite Element Analysis of Centrally-Debonded Composite Sandwich Beam under Four Point Bending
  Published in: Advanced Materials and Structures (p351)
• Force Measurement by AFM Cantilever with Different Coating Layers
  Published in: Experimental Mechanics in Nano and Biotechnology (p377)
• Glass Transition Temperature of Phenolic-Based Nanocomposites Reinforced by MWNTs and Carbon Fibers
  Published in: Advances in Composite Materials and Structures (p713)
• Interfacial Property between Graphite/Epoxy Laminate and MWNTs/Polymer Nanocomposites
  Published in: Multi-Functional Materials and Structures III (p133)
• Reliability Analysis in Flip Chip Package under Thermal Cycling
  Published in: Advances in Fracture and Failure Prevention (p489)