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Articles by author: N. Balandina

• Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'
  Published in: Grain Boundary Diffusion and Grain Boundary Segregation (p181)
• Diffusion in Thin Films under Potential Field
  Published in: Diffusion in Materials DIMAT 1996 (p1499)
• Formation of SiC-AIN Solid Solution by Combustion Nitridation of Al with SiC
  Published in: The Science of Engineering Ceramics II (p91)
• Models for Grain Boundary Diffusion in Thin Films Under Stress Fields in Different Kinetic Regimes
  Published in: Intergranular and Interphase Boundaries in Materials (p553)
• Stresses Effect on Grain Boundary Diffusion in Thin Films
  Published in: Diffusion and Stresses (p151)