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Papers by Author: P. Gentile

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Direct Wafer Bonding for Nanostructure Preparations

Authors: Hubert Moriceau, F. Rieutord, C. Morales, A.M. Charvet, O. Rayssac, B. Bataillou, F. Fournel, J. Eymery, A. Pascale, P. Gentile, A. Bavard, J. Mézière, Christophe Maleville, B. Aspar

Abstract: Direct Wafer Bonding has been widely developed and is very attractive for a lot of applications. Using original techniques based on direct bonding enable to carry out specific engineered substrates. Various illustrations are given among which twisted Si-Si bonded substrates, where buried dislocation networks play a key role in the subsequent elaboration of nanostructures.

Photorefractive Effect in CdTe Quantum Wells

Authors: H. Haas, P. Gentile, N. Magnea, J.L. Pautrat, S. Gosselin, J.Y. Moison, Ph. Gravey, L.S. Dang

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