Papers by Author: Petr Kubíček

Abstract: Problems of reactive diffusion at the solid phase and melt contact are studied theoretically. The rate constant is a fundamental parameter characterizing the dissolving rate at a certain configuration of experiment. Relationships between the solid phase dissolving rate, i.e. the solid phase interface boundary movement in the melt, and rates of growth of intermetallic phases in the metal (Cu) are observed. This procedure enables the creation of surface and subsurface layers of regulated thickness in metallic materials by means of reactive diffusion. The main intention was an experimental study of copper dissolving in melts of various solder alloys and the related reactive diffusion. We used Sn, SnCu, SnAgCu, SnZn and SnIn alloys as a solder material. The problems that need to be solved preferentially are emphasized. It concerns especially the determination of the rate constant of dissolving and verifying whether the proposed model equations can be used for this constant determination in cases of cylindrical and planar dissolving. Rapid growth of phases in the metal (Cu) and determination of the thickness of layers with these phases pose considerable time demands to X-ray microanalyses (WDX, EDX, BSE, SEM) of specimens after their long-time heating.

Abstract: Problems of reactive diffusion at the solid phase and melt contact were studied theoretically and experimentally. The main intention was to calculate the time course of the solid phase dissolving in the case of cylindrical dissolving. These calculations were carried out on the assumption for the rate constant of dissolving K = const. In our work we give heed especially to the dominating process, which is the solid metal A dissolved in the melt B. During the dissolving the melt B saturates with the metal A and the process is influenced by convections which are characteristic for the given experimental configuration. A theoretical description of the kinetics of the solid phase dissolving in the melt will be presented for the case of cylindrical dissolving. The aim is to derive a relation for the interface boundary movement c(t) in dependence on time and a time course of growth of the element A concentration in the melt B. There are problems with accurate determination of the interface boundary movement after certain heating times of specimens, when it is observed experimentally, since intermetallic phases create in the original A metal at both the diffusion and cooling and some phases segregate at the solidifying melt cooling. The main intention was an experimental study of the copper dissolving in the tin melt. Experiments aimed to the determination of the Cu wires (diameters from 0.5 to 3.5 mm) dissolution in the solder melt were carried out at various selected temperatures and times. Rapid growth of phases in the metal A and determination of the thickness of layers with these phases pose considerable time demands to X-ray micro-analyses (WDX, EDX) of specimens after their long-time heating.

Abstract: Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. In our work we give heed especially to the dominating process, which is the solid metal A dissolving in solder melt B. During the dissolving, melt B saturates with metal A, and the process is influenced by convections which are characteristic for a given experimental configuration. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphase boundary movement (t) depending on time and a time course of growth of the element A concentration in the melt B. There are difficulties in accurate determination of the interphase boundary movement after heating of specimens for certain time intervals. It should be performed experimentally, since intermetallic phases are formed in original metal A both via diffusion and upon cooling and some phases segregate upon cooling of the solidifying melt. The main intention was to study experimentally the copper dissolving in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu plate dissolving in the solder melt were carried out at various selected temperatures and times. The problems of reactive diffusion were studied both theoretically and experimentally and the problems that have to be solved preferably were emphasized. Concentration profiles of elements and thickness of layers of phases can be determined with SEM and X-ray microanalyses (WDX, EDX) of specimens after their diffusion heating.

Abstract: In this work we give heed especially to the dominating process which is the solid metal A dissolving in the melt B. During the dissolving, the melt B saturates with the metal A and the process is influenced by convections which are characteristic for the given experimental configuration. A theoretical description of the kinetics of the solid phase dissolving in melt will be presented for the case of planar and cylindrical dissolving. The aim is to derive a relation for the interface boundary (t) movement in dependence on time and a time course of growth of the element A concentration in the melt B. There are problems with an accurate determination of the interface boundary movement after certain heating times of specimens, when it is observed experimentally, since intermetallic phases create in the original A metal at both the diffusion and cooling and some phases segregate at the solidifying melt cooling. The rate constant is a fundamental parameter characterizing the dissolving rate at a certain configuration. We present a theoretical description of dissolving of a long metallic cylinder submerged into a melt column and relations for the rate constant determination from the time of the whole metallic cylinder dissolution are derived. In our experiments were performed in which Cu was dissolving in the Sn melt for a Cu cylinder (wire) diameters 0.8÷2.5 mm and the rate constant K (T = 350°C) was determined. Relationships between the solid phase dissolving rate, i.e. the solid phase interface boundary movement (t) in the melt and rates of growth of intermetallic phases in the metal A will be observed. This procedure enables to create surface and subsurface layers of regulated thickness in metallic materials by means of reactive diffusion.

Abstract: When developing new types of materials with special properties for the automotive industry, steels with high content of manganese (up to 25 wt. % Mn) were studied. These steels embody increased failure resistance, high level of deformation hardening, plastic response and high value of energy absorption in crash situations [1,2]. The aim of our work was to study an interaction of a FeMn alloy with pure iron from the view of diffusion processes. For that purpose, diffusion joints Fe/FeMn-steel were created and long-term heated at the temperatures of 800, 900 and 1050 °C. Dependences of diffusivities of Mn on its concentration were calculated from concentration profiles of manganese after diffusion heating applying three analytical methods. In the first method, constant values of diffusivities Di, i = 1,2 for both Fe and steel were taken into account. In the second case a modified Matano-Boltzmann method utilizing polynomials was applied, which simplifies solution in numerous cases. The third method performs the solution of the non-linear equation of diffusion on the assumption of a linear dependence of diffusivity on concentration applying a procedure based on perturbation calculus. The results of the solution will be graphically documented in details together with the description of experiments.

Abstract: Interaction of lead-free solders with copper substrate represents an important phenomenon in the issue of reliability of solder joints. New experimental data describing phase equilibria in the Cu-In-Sn system after long-time diffusion annealing at the 400 °C/50 hours, 600 °C/310 hours and 600 °C/48 hours will be presented. The composition of solders was: 100 % Sn, 75 % Sn + 25 % In, 50 % Sn + 50 % In, 25 % Sn + 75 % In, 100 % In. The fast quenching method was employed to freeze thermodynamic equilibrium after annealing, followed by metallography, microhardness measurements, SEM (Scanning Electron Microscope) and WDX (Wave Dispersive X-ray) analysis. New phase equilibrium data, together with the data from literature, represent the best existing experimental description of phase equilibria in the system in question. The obtained experimental results of the phase equilibria were compared with the thermodynamic modelling by the CALPHAD (Calculation of Phase Diagrams) method and with other authors.