Papers by Author: S.H. Lee

Abstract: Effects of 0.5 wt% Sn-addition to the dental casting Au-12Pt-0.6Cu alloy on the interfacial microstructures and bonding strength between porcelain and the alloy were investigated. Porcelain powders (SiO2-based oxides) are bonded through a thermal schedule consisting of preoxidation, 1st firing, and 2nd firing. Interfacial microstructures were examined after pre-oxidation and 2nd firing, respectively, by scanning and transmission electron microscopy. The bonding strength of the Au-12Pt-0.6Cu and Au-12Pt-0.6Cu-0.5Sn alloys with porcelain was about 24.6 MPa and 46.2 MPa, respectively. The higher bonding strength of the Sn-added alloy compared with that of the alloy without Sn is attributed to the SnO2 formed at the interface between porcelain and the alloy during pre-oxidation. SnO2 layer is thought to enhance chemical bonding with various oxides in the porcelain and, accordingly, improve bonding strength.

Abstract: The effect of indium on the microstructures and mechanical properties of a Au-Pt-Cu alloy was investigated. The Au-Pt-Cu-xIn alloys heat-treated at 550°C for 30 min revealed a maximum hardness value of 207 HV, irrespective of the heat temperature and In contents. Also, the hardness of the Au-Pt-Cu-xIn alloys (x = 0.5, 1.0, 1.5, 2.0) aged at 550 °C rapidly increased with increasing aging time, and it reached an almost constant value after 30 min. The hardness of the Au- Pt-Cu-xIn alloys aged at 550°C for 30 min increased with increasing In content until 1.5wt%, but it slightly decreased with more increasing In content. Also, a variation of the tensile strength of the alloys with In contents showed a similar trend of hardness change with In contents. Analysis of EDS and TEM revealed that the microstructure of Au-Pt-Cu-xIn alloys is composed of solid solution with fcc structure and intermetallic InPt3 precipitate with L12 structure. Based on this investigation, it can be concluded that an increase in hardness of Au-Pt-Cu-xIn alloys is ascribed to a complex effect of the precipitation hardening of InPt3 and the grain size refinement.

Abstract: Effects of 0.5 wt% Indium addition on the oxidation of Au-Pt-Cu alloy, the interfacial microstructure and bonding strength between porcelain and Au-Pt-Cu-xIn alloys(x = 0, 0.5wt%) were investigated using scanning electron microscopy, X-ray diffractometry, transmission electron microscopy, and a tensile tester. The bonding strength of the Au-Pt-Cu and Au-Pt-Cu-0.5In alloys with porcelain was about 24.6 MPa and 49.5 MPa in average, respectively. This higher bonding strength in the Au-Pt-Cu-0.5In alloy compared with the Au-Pt-Cu alloy without In is ascribed to the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy. Especially, the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy leads to enhancing chemical bonding between In2O3 and various oxides in porcelain, and also to improving the anchoring effect.