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Articles by author: Seong Ho Son

• A Kinetic Study on the Electrodeposition of Ni-Cr Alloy on Copper for Embedded Resister Layer in PCB
  Published in: Multi-functional Materials and Structures (p754)
• Characteristics of Silver Electrodeposition Solution and Silver Film Fabricated by Electrodeposition with Additives for Interconnection
  Published in: Multi-functional Materials and Structures (p758)
• Development of Free Nitric acid, Non-P Desmut Solution for Surface Treatment Aluminium Alloys
  Published in: Eco-Materials Processing and Design IX (p309)
• Development of Noble Metal Oxide Electrode for Low Oxygen Evolution
  Published in: Multi-functional Materials and Structures (p750)
• Development of Recycled TiH₂ Feedstock for Powder Injection Molding
  Published in: Materials Processing Technology (p3024)
• In-Mold Rheology Curves with Feedstock and Mold Dimension
  Published in: Materials Processing Technology (p3028)
• Manufacturing Technology of μ-Gear and Mold by Fe-Ni Alloy Electroforming
  Published in: Materials Processing Technology (p3032)
• Microstructures and Oxygen Reduction of Recycled TiH₂ Powders during Sintering
  Published in: Multi-functional Materials and Structures (p995)
• Ultrasonic Polishing of Electric Discharge Machined Surface Using Al₂O₃ Suspension
  Published in: Materials Processing Technology (p53)
• Vibration Characteristics of Ni Thin Film Diaphragm by Acoustic Wave
  Published in: Manufacturing Science and Engineering I (p2361)