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Articles by author: Sheng Qiang Bai

• Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer
  Published in: Functionally Graded Materials VII (p301)
• Effect of C₆₀ Particle Dispersion on Thermal Conductivity of CoSb₃
  Published in: Composite Materials III (p75)
• Effect of TeI₄ Content on Thermoelectric Properties of N-Type Bi₂(Te,Se)₃ Materials Prepared by Spark Plasma Sintering
  Published in: High-Performance Ceramics III (p393)
• Effect of Ti₃SiC₂ Content on Mechanical Properties of Ti₅Si₃-TiC-Ti₃SiC₂ Composites
  Published in: High-Performance Ceramics IV (p1383)
• Effect of TiC Content on Fracture Toughness of TiC-Ti₅Si₃ Composites
  Published in: High-Performance Ceramics III (p1885)
• Fabrication and Microstructure of MoSi₂/Al₂O₃ Functionally Graded Material
  Published in: Functionally Graded Materials VII (p195)
• High Temperature Thermoelectric Property of Sr-Filled Skutterudite Sr_yCo₄Sb₁₂
  Published in: High-Performance Ceramics IV (p842)