Papers by Author: Shih Tsung Ke

Abstract: The influence of surfactant CTAB (cetyl trimethyl ammonium bromide) on electrodeposited nickel layer has been investigated in this research. Our result shows that CTAB added in the electrolysis bath can effectively remove the hydrogen to obtain a smoother nickel layer. The effect of CTAB on the surface roughness is also significant. It may be ascribed to the adsorption of CTAB on the electrode surface which results in a hindering effect in the electrodeposition process. Increasing the concentration of CTAB, the grain size of nickel deposit was reduced and the microhardness of the nickel deposit was therefore improved. The hardness of the metal layer can be promoted to 450 Hv when 300 ppm CTAB is added.

Abstract: In this study, a Ni-P alloy electroforming nanostructure material with low surface roughness and low internal stress was developed by using a pulse current. Square-wave cathodic current modulation was employed to electrodeposit ultrafine-grained Ni-P films from an additivefree Sulfamate nickel bath. The effect of various factors, such as peak current density, duty cycle and pulse frequency on the roughness and internal stress were investigated. Pulse current significantly influences the microstructure of Ni-P alloys. The internal stress and roughness of Ni-P alloys increased as peak current density increased, but the internal stress of Ni-P alloys decreased as duty cycle decreased.