Papers by Author: Shu Sheng Li

Abstract: A new high frequency induction brazed monolayer diamond wire saw for cutting aluminum alloy thick plate is developed with the helical continuous cutting edge distance on the wire surface. In order to solve the problems of forming cutting aluminum alloy plates,the brazed diamond wire saw is used to conduct the preliminary cutting tests on the 50 mm aluminum alloy plates on the modified grinder experimental platform.The results indicate that the cutting efficiency of the brazed diamond wire saw is increased with the increasing of the feed tension, the wire saw line speed and the diamond grits size. Furthermore, some cutting chips shape of the aluminum alloy is presented based on experimental cutting.

Abstract: By using ANSYS, the temperature distribution in workpiece of steel 48MnV under the actions of a moving thermal source, is first carried out by FEM for non-linear transient temperature field. On this basis, the residual stress distribution in the workpiece under the action of temperature variation and moving grinding loads is determined by FEM for thermo elastic-plasticity. The result shows that the existent residual stress on surface of grinding hardening is press. The reason of this is discussed. The difference between the simulated value and measured value of grind-hardening stress is acceptable.

Abstract: An investigation was undertaken to explore the grinding energy and removal mechanisms in grinding zirconia by using brazed diamond wheels. The grinding forces were measured and the morphological features of ground workpiece surfaces were examined. The results indicate that material removal mechanisms are dominated by the combined removal modes of brittle and ductile. The prevailing removal mechanism for the ground surface of zirconia changes from brittle to ductile when the maximum chip thickness change from large to small.

Abstract: A new brazed monolayer diamond grinding wheel is developed with the same continuous cutting edge distance on the wheel surface. Surface/subsurface damage of yttria partially stabilized zirconia (Y-PSZ) in grinding using monolayer brazed diamond wheel is analyzed. In this investigation, the influence of the maximum undeformed chip thickness (hm) on material removal mechanism is analyzed. The experiment results show that the ground surface is almost in ductile material removal mode when hm is below the critical value for Y-PSZ, otherwise it will be the combined removal modes of brittle and ductile when hm is above the critical value.