Papers by Author: Ting Chao Han

Abstract: The application of the wheel used in super-high speed point (SHSP) grinding is introduced in detail, depicting the applied rang of the wheel, through designing the wheel body and the layer of CBN in the wheel. The designed principle is inferred according to the specific shape, the grinding productivity is analyzed in the course grinding zone and the finished grinding zone, introducing the angle of course grinding zone, which affects the grinding parameters in SHSP grinding, the value of the angle is designed to be suited to the point grinding, and manufacturing the wheel, introducing the changed state of chip flowing grinding used in the new wheel, the micro-surface of the wheel is observed through microscope, whose the ratio of air hole and the layer of CBN are analyzed, simulating the wear trend of the new wheel, the conclusions about super hard abrasives and wearing are drawn at last, the application of SHSP grinding is related to designing and manufacturing of the wheel, which provides the equipment for realizing high precision and productivity processing and offers the referred basis for the theoretical research.

Abstract: In this paper, effective finite element model have been developed to simulation the plastic deformation cutting in the process for a single particle via the software of ABAQUS, observing the residual stress distribution in the machined surface, the experiment of grinding cylindrical workpiece has been brought in the test of super-high speed grinding, researching the residual stress under the machined surface by the method of X-ray diffraction, which can explore the different stresses from different super-high speed in actual, and help to analyze the means of reducing the residual stresses in theory.

Abstract: The technology of super-high speed point (SHSP) grinding will bring in higher precision and productivity for component manufacturing. The surface roughness attained by SHSP grinding is analyzed in this paper based on the contact area and the probability distribution of chip thickness while the swivel angle of α exists, proposing a new method to predicate the value of the roughness, the experiment of SHSP grinding is carried out whether α exists or not to verify the theoretical analysis in the paper, through observing the micro-surface after grinding, the conclusions will be drawn at last.