Papers by Author: V.G. García

Abstract: Previous research works assert that the observed increase in hot flow stress of commercially pure copper is attributed to the interactions between solute atoms and dislocations, specifically by interstitial oxygen. This work shows TEM images of the formation of Cu2O precipitates after warm working temperatures that in part help explain the increase of stress during hot compression of 99.9% pure copper. Three commercially pure large-grained coppers with 26, 46 and 62ppm of oxygen were tested at different temperatures (600°C-950°C) and strain rates (0.3s-1- 0.001s-1). At temperatures below 850°C, the stress differences between coppers, tested at same the strain rate, became increasingly higher. A correlation between stress increase and oxygen content was found. Precipitation of nanometric Cu2O did not show any difference in dynamically recrystallized grain size; however hardness tests showed that the final properties were modified. This work discusses the effect precipitation of Cu2O has on the hot flow curve and the final microstructure of hot formed 99.9% pure copper with different oxygen levels.

Abstract: Modelling hot flow stress during grain refinement operations of fcc metals has largely included the use of an Avrami type equation to describe the decrease in stress due to Dynamic Recrystallization (DRX). However when refining large-grained copper, the processing temperatures and strain rates often produce a multi peak behaviour, which is not predictable by an Avrami equation alone. If an initial grain size, D0, is greater than the stable dynamically recrystallized grain size, Drex, which is a function of the Zener-Hollomon Parameter, Z, then the material will tend to refine. However if the current the Zener-Hollomon value, given by current temperature and strain rate conditions, is lower than a critical value, Zc, which depends on D0, then a multi peak stress behaviour is expected while refining. The latter Relative-Grain-Size model (i.e. the D0-Zc and Drex-Z relationships plotted on the same log-log graph) is a practical model that allows determination of whether a material will grain coarsen or refine and whether the dynamic recrystallization behaviour will be monotonic or with multi peaks. The present authors devised a dynamic recrystallization algorithm to measure the stress due to the diminishing initial grain volume and to measure the correction stress due to recrystallizing grains. Analysis on the hot (600°C-950°C) compression data of a 99.9% pure copper inductively lead to the use of an Avrami type equation to describe the stress contribution produced by the deformation of the remaining initial grain volume and a damped cosine equation to describe the stress contribution of the synchronized volume of new grains. This work discusses the experimental evidence and analytical findings that inductively support the mathematical description of the stress-strain curve given by a Damped Cosine Avrami Model for discontinuous DRX.

Abstract: Anodizing is widely used in the surface treatment of aluminium alloys in order to preserve the integrity of the alloy surface, to minimize the need for maintenance and repair, and to maximize the component life. The aim of this work is to study the influence heat treatments (T5 and T6) have on the anodization of A357 aluminium alloy produced by a Thixocasting process. In particular the effect of shape, size and distribution of silicon and intermetallic phases on the anodic oxide film formation. SEM and EDS analyses were used to examine the microstructural features found on, within and under the anodic oxide layer. Experiments using a tribometer (pin-on-disc tests) were performed in order to evaluate the friction and wear properties of the different layers.