Papers by Author: W. Gao

Abstract: The endless diamond wire saw was developed using complex electroplating method. The sawing process on granite was experimented. The effects of diamond grain size, feed load, wire speed, and granite properties on sawing process were investigated. It is proved that the edges of sawing slot of granite were regulative and the cutting surfaces were smooth. The cutting efficiency could be improved by increasing the diamond grain size, wire speed, and feed load. However the increase of the feed load would induce higher tangential cutting force, and the case of the effect of wire speed was reversed.

Abstract: A better understanding of the hard-brittle material removal mechanism in wire-sawing provides a basis for optimizing the wire-saw and processing parameters. The maximum cutting depth of each diamond grain in wire-sawing is given. It is proved theoretically that the deformation mode on the machined hard-brittle material surface gradually shifts from brittle fracture to ductile deformation with the increasing of wire-saw velocity, the decreasing of infeed velocity and the decreasing of average grain size. The experimental investigation on the wire-sawing of granite is carried out. It is shown that in the case of wire-saw velocity of 20m/s, infeed velocity of 0.15mm/s and diamond grain size of 200~230#, the removal mechanism in wire-sawing is ductile mode.