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Articles by author: Wei Li

• A Study of a New ELID Grinding Fluid by BP Neural Network Model
  Published in: Information Technology for Manufacturing Systems II (p1792)
• A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer
  Published in: Advances in Materials Manufacturing Science and Technology II (p472)
• A Study on Pressure Stability in Double-Sided Polishing Process
  Published in: Advances in Abrasive Technology XIII (p64)
• A Study on Surface Quality of GaN with CMP Polishing Process
  Published in: Materials Processing Technology (p1764)
• Development of a New BCB ELID Lapping Process
  Published in: Materials Processing Technologies (p1739)
• Grinding Performance of Permeated Grinding Wheel
  Published in: Manufacturing Process Technology (p121)
• Motion Analysis of Ball Grinder with Dual-Rotating Plates Lapping Mode
  Published in: Advances in Grinding and Abrasive Technology XV (p295)
• Research on Electrical Discharge Truing for Precision Profile Grinding with Cast Iron-Bonded Diamond Wheel
  Published in: Advances in Abrasive Technology XII (p181)
• Research on Stock Removal Uniformity for Double Sided Polishing Process
  Published in: Precision Surface Finishing and Deburring Technology (p223)
• Research on the Basic Properties of the Bamboo Charcoal Bonded Grinding Wheel
  Published in: Advances in Grinding and Abrasive Technology XV (p416)
• Study on Electrolysis Performance of Bamboo Charcoal Bonded Grinding Wheel
  Published in: Surface Finishing Technology and Surface Engineering II (p447)
• Study on the Behavior of the Cast-Iron Bonded Grinding Wheel to Machining Properties of Hard and Brittle Materials
  Published in: Precision Surface Finishing and Deburring Technology (p229)
• The Experimental Study of Phase Transformation Heat─Transfer in Simulation of Grinding of Ti Alloy
  Published in: Advances in Grinding and Abrasive Technology XIV (p548)
• The Modeling and Simulation of Pneumatic Loading System of Double-Sided Polishing Machine
  Published in: Advances in Grinding and Abrasive Technology XV (p154)
• The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer
  Published in: Advances in Grinding and Abrasive Technology XIV (p324)