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CONFERENCE
6/16/2013 - 6/19/2013
The 7th International conference on Physical and Numerical Simulation of Materials Processing
5/16/2013 - 5/19/2013
2nd International Congress on Advanced Materials
4/13/2013 - 4/14/2013
2013 2nd lnternational Conference on lntclligent Materials, Applied Mechanics and Design Science (IMAMD 2013)
more...
Articles by author: Wei Peng
26 papers on 2 pages:
1
[2]
[next]
Bilingual Teaching Design and Teaching Case of “Advanced Manufacturing Technology”
Published in:
Frontiers of Manufacturing and Design Science II
(p1470)
Bilingual Teaching in University Should Act as a Final Ring in the Foreign Language Education Chain in China
Published in:
Frontiers of Manufacturing and Design Science II
(p3824)
Bond Strength Analysis among Layers of Grinding Wheel
Published in:
Frontiers of Manufacturing and Design Science II
(p38)
Development of a Dicing Blade Using Light-Hardening Resin
Published in:
Advances in Abrasive Processes
(p99)
Dielectric and Ferroelectric Properties of Ba
1-x
Sr
x
TiO
3
Thin Films Prepared by Pulsed Laser Deposition
Published in:
High-Performance Ceramics III
(p81)
Electrochemical Machining of the Turbulated Hole
Published in:
Manufacturing Science and Engineering I
(p4088)
Experimental Study on New Bonding Materials for Developing Nano-Grinding Plates
Published in:
Advances in Abrasive Technology IX
(p489)
Experimental Study on Parameter Optimization of Silicon Wafer CMP Using Composite Abrasives Slurry
Published in:
Ultra-Precision Machining Technologies
(p214)
Fabrication of Micro-Structures by Micro-ECM
Published in:
Ultra-Precision Machining Technologies
(p229)
Manufacturing of Fixed-Abrasive Polyethylene Wire Saw
Published in:
Frontiers of Manufacturing and Design Science II
(p1595)
New Researches for Fabrication of Micro-Pin in Micro-ECM
Published in:
Ultra-Precision Machining Technologies
(p205)
Numerical Simulation on the Airflow of Electric Cutting Tool
Published in:
Manufacturing Science and Engineering I
(p3691)
Prediction of Erosion Profiles during ECM of Spiral Holes
Published in:
Advances in Materials Processing IX
(p428)
Preparation and its Silica Wafer CMP Performance of Cationic Polyelectrolyte Modified Benzoguanamine Formaldehyde/SiO
2
Composite Abrasives Slurry
Published in:
Manufacturing Process Technology
(p4158)
Research of Photosensitive Resin Blade with Metal-Coated Abrasive
Published in:
Advances in Grinding and Abrasive Technology XIII
(p71)
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