Papers by Author: Xi Peng Xu

Abstract: In the present research work, a new precision sawing technique is proposed, by which the ceramic workpiece is ultrasonically vibrated along the blade radial direction during the sawing operation using a diamond blade. In this study, experiments are conducted to study the sawing force characters of ultrasonic vibration-assisted sawing (UVAS) and conventional sawing (CS). The influences of the sawing parameters on the sawing force and force ratio are investigated. The results show that the sawing force in UVAS is smaller than those in CS. It was found that applying ultrasonic vibration to the sawing operation decreased the normal sawing force 18%-38% and tangential sawing force by 10%-25%. The force ratio in UVAS is lower than that in CS, which reveals that diamonds are easier to cut into the ceramic workpiece and the material machinability is improved.

Abstract: Fixed-abrasive wires, such as electroplated diamond wires and resinoid diamond wires, employed for slicing ingots have the problems of high tool wear. A novel brazed diamond wire has been developed to overcome these problems. This paper investigates the effect of process parameters, including brazing temperature, brazing time and brazing filler composition, on the brazed diamond wire manufacturing with CuSnTi brazing filler. The 3D micro-video system was used to observe the brazed diamond wire surface. Tensile, bending and torsional test were carried out to evaluate the mechanical properties of brazed diamond wire. A brazed diamond wire with 3km length was fabricated with the optimization process parameters, which was successfully used to slice glass.

Abstract: The path distribution can directly affect the machined workpiece surface quality in lapping and polishing, such as planeness, roughness, etc. In present paper, the influence of rotate speed ratio (RSR) and abrasive position on path distribution was analyzed with a single fixed abrasive. The results show that the RSR and abrasive position has heavy influence on the path distribution. The path distribution with decimal RSR is more intensive and complicate than that with integer RSR, especially complex decimal RSR, and it can be also affected by the abrasive radial and circumferential position, but the shape of path is not changed with different abrasive circumferential position which only affects the initial phase angle of path.

Abstract: In this paper, in order to avoid aggregate of nanodiamonds and reduce the damage problem caused by the hard abrasives during polishing, a kind of ultra-fine nanodiamond abrasive polishing pad was fabricated by means of sol-gel technology. The polishing pad was then used to polish silicon wafer on a nano-polishing machine. The surface morphologies and roughness were measured by both optical microscope and atomic force microscope (AFM). It is found that it was easy to machine the silicon wafer to mirror surface after polishing with the nanodiamond pad. And the surface roughness of the silicon wafer was reduced to 0.402 nm.